Study on preparation and properties of bentonite-modified epoxy sheet molding compound

a study on construction of iranian life tables: the case study of modified brass logit system

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Characterization of the viscoelastic properties of an epoxy molding compound during cure

In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. These residual stresses add up to the st...

A coarse-grained model for epoxy molding compound.

We present a coarse-grained model for molecular dynamics simulations of an epoxy system composed of epoxy phenol novolac as epoxy monomer and bisphenol-A as the cross-linking agent. The epoxy and hardener molecules are represented as short chains of connected beads, and cross-linking is accomplished by introducing bonds between reactive beads. The interbead potential, composed of Lennard-Jones,...

Characterizing the Mechanical Properties of Callaways Forged Carbon Fiber Reinforced Sheet Molding Compound

extraction and acetylation of purified trypsin from bovin pancreas and study of some its physico-chemical properties

آنزیم تریپسین در شرایط قلیایی ناپایدار می باشد .و فعالیت پروتئولیتیکی تریپسین منجربه خود هضمی آن در جایگاههای خاصی می گردد. بنابر این آنزیمی با ناپایداری بالا محسوب میگردد. در سالهای اخیر موفق شدند که با ایجاد تغیرات شیمیایی با اضافه کردن فلزات خاص ، کلسیم و یا عمل استیلاسیون منجر به افزایش پایداری آنزیم تریپسین گردند. مطالعات در حال حاضر نشان می دهد که تریپسین استیله شده فعالیت آنزیمی خود را ...